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InFo and WMCM refer to Integrated Fan-Out packaging and Water-Level Multi-Chip Module packaging.
The difference between the two is that InFo enables integration of components within the packaging.
The focus here is on single-die packaging and memory is attached to the main system-on-chip.
WMCM, meanwhile, integrates multiple components in the same packaging.
It’s supposed to a be more flexible arrangement.
As for the 2nm and 3nm nomenclature, it refers to the chip architecture.
As the number gets smaller, it means that the chips can feature smaller transistors.
The smaller the transistor, the more that you’re able to shove onto a chip.
In general, this leads to increased processing power, speed and efficiency.
Apple has been obsessed with making thinner and thinner devices.
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